material overview

What materials does
adhesive tape stick to?

What does liability depend on?

When bonding fails in industrial environments, the cause is rarely the adhesive tape itself. In practice, it is much more common for the substrate to fail — because it has not been understood, evaluated or prepared properly. The idea that "good adhesive tape = secure adhesion" is therefore too simplistic. The decisive factor is what needs to be bonded — not just what is used to bond it.

This is precisely where the flaw in the thinking behind many projects begins: The search for the "right adhesive tape" begins before the substrate has been classified. Without this assessment, any material decision is a shot in the dark — with risks of rejects, complaints and legal costs.

The 3 factors of adhesiveness

When bonding one material to another using adhesive tape or moulded adhesive tape, there are three factors to consider in order to ensure that the bond is successful.

If one of these factors is missing, the entire connection becomes unstable and can only be constructed using advanced methods. The factors that need to be taken into account are broken down below.

Material selection (substrate)

The substrate determines the chemical and physical properties that influence adhesion:

  • Chemical composition (polar/non-polar)

  • Molecular structure (e.g. amorphous vs. semi-crystalline)

  • Thermal expansion, flexibility

  • Plasticiser content / additives / fillers

These factors affect the surface energy and thus the wettability of the adhesive.
The substrate therefore determines the basic nature of the adhesion – what is fundamentally possible or difficult.

Surface texture

The actual outer layer of the substrate that comes into contact with the adhesive.

 

Even if the substrate is theoretically "good for bonding", the nature of the surface determines how well adhesion can actually be achieved.

Various factors can have a positive or negative effect on this.
For example, the surface of a material changes as soon as it is painted.
Other influencing factors can include:

  • Cleanliness (dust, oil, release agents, finger grease)
  • Roughness/topography (microscopic structure)
  • Moisture (water film or condensation)
  • Coatings (primers, paints, fluorinations, silicones)
  • Ageing/oxidation (rust, swelling)
  • Pre-treatments (corona, plasma, flame, primer)

Surface energy

The surface energy of a material describes how strongly a surface tends to interact with other substances (e.g. liquids, adhesives).
The higher the surface energy, the more "wettable" it is – meaning that an adhesive can spread more evenly and build up stable adhesion more easily.

 

Rule of thumb:
Only when the surface energy of the substrate is higher than the surface tension of the adhesive can the adhesive "flow" well. Accordingly, good wetting leads to strong adhesion.

In practice, this means:

  • With high-energy materials (from approx. 38 mN/m), the adhesive film "flows" well, resulting in a strong bond.

  • With low-energy materials (below approx. 37 mN/m), the adhesive tends to "bead up" = weak bond.

Material overview

Low energy
Material Abkürzung mN/m
Polytetrafluoroethylene PTFE 18
Silicone SI 24
Polyvinyl fluoride PVF 25
Natural rubber NR 25
Butyl rubber BR 27
Polypropylene PP 29
Polyethylene PE 31
Polyester PBT 32
Acrylonitrile butadiene styrene ABS 35
Polyamide PA <36
Polymethylmetacylat PMMA <36
Epoxy EP <36
Polyacetal POM <36
Polyvinyl alcohol PVA 37
MEDIUM AND HIGH ENERGY
Material Abbreviation mN/m
Polystyrol PS 38
PS-Phemoloxid PSPO 38
Polychloroprene CR 38
Polyvinylchlorid PVC 39
Celluloseazatat CA 39
Polyester PET 41
Polyimide PI 41
Phenolic resin PF 42
Polyurethan PUR 43
Polyethylenterephtalat PETP 43
Polyamide 6.6 PA 43
Unbleached polyester UP 43
Polycarbonat PC 46
Polyphenylenoxid PPO 47
Styrol Butadien Rubber SBR 48
Polyethersulfon PES 50
Lead PB 450
Aluminium AL 840
Copper CU 1100
Iron Fe 2030

Economic relevance

In development projects, a lot of time is often spent on selecting the adhesive – while the substrate remains unchanged. This focus is strategically wrong and causes hidden costs in three areas:
 

Rework & complaints = feasibility
Incorrectly bonded components must be
reworked or replaced – often only becoming
apparent late in the process.                                            
Process uncertainty as a risk factor
A bond that only holds ‘under good
circumstances’is a cost risk
in series production.                                         
Wrong decisions in material purchasing
If series materials are selected without
checking their bondability, expensive
changes are inevitable later on.

 

The technically correct sequence is therefore not – ‘Which adhesive is suitable for my component?’ but rather: 
 

1. First classify the substrate                                                         2. Select the adhesive system                              3. Define the process                                

 

This sequence minimises project durations, validation loops and quality fluctuations.

Advice for your proceedings

Are you currently planning a project and want to rely on expertise and experience?
Then please feel free to contact us and we will support you throughout the entire planning process.

 

The process is already in place? – No problem either!
We are also happy to support existing projects and contribute as partners and problem solvers!

 

 

 

 

 

Back to overview

Vanessa Becker

Do you have questions about other topics or would you like to learn more about specific applications? Then feel free to contact me.

 

I am looking forward to your input for our blog!

vbe@innotape.de