When bonding fails in industrial environments, the cause is rarely the adhesive tape itself. In practice, it is much more common for the substrate to fail — because it has not been understood, evaluated or prepared properly. The idea that "good adhesive tape = secure adhesion" is therefore too simplistic. The decisive factor is what needs to be bonded — not just what is used to bond it.
This is precisely where the flaw in the thinking behind many projects begins: The search for the "right adhesive tape" begins before the substrate has been classified. Without this assessment, any material decision is a shot in the dark — with risks of rejects, complaints and legal costs.
When bonding one material to another using adhesive tape or moulded adhesive tape, there are three factors to consider in order to ensure that the bond is successful.
If one of these factors is missing, the entire connection becomes unstable and can only be constructed using advanced methods. The factors that need to be taken into account are broken down below.
The substrate determines the chemical and physical properties that influence adhesion:
Chemical composition (polar/non-polar)
Molecular structure (e.g. amorphous vs. semi-crystalline)
Thermal expansion, flexibility
Plasticiser content / additives / fillers
These factors affect the surface energy and thus the wettability of the adhesive.
The substrate therefore determines the basic nature of the adhesion – what is fundamentally possible or difficult.
The actual outer layer of the substrate that comes into contact with the adhesive.
Even if the substrate is theoretically "good for bonding", the nature of the surface determines how well adhesion can actually be achieved.
Various factors can have a positive or negative effect on this.
For example, the surface of a material changes as soon as it is painted.
Other influencing factors can include:
The surface energy of a material describes how strongly a surface tends to interact with other substances (e.g. liquids, adhesives).
The higher the surface energy, the more "wettable" it is – meaning that an adhesive can spread more evenly and build up stable adhesion more easily.
Rule of thumb:
Only when the surface energy of the substrate is higher than the surface tension of the adhesive can the adhesive "flow" well. Accordingly, good wetting leads to strong adhesion.
In practice, this means:
With high-energy materials (from approx. 38 mN/m), the adhesive film "flows" well, resulting in a strong bond.
With low-energy materials (below approx. 37 mN/m), the adhesive tends to "bead up" = weak bond.
| Material | Abkürzung | mN/m | |
| Polytetrafluoroethylene | PTFE | 18 | |
| Silicone | SI | 24 | |
| Polyvinyl fluoride | PVF | 25 | |
| Natural rubber | NR | 25 | |
| Butyl rubber | BR | 27 | |
| Polypropylene | PP | 29 | |
| Polyethylene | PE | 31 | |
| Polyester | PBT | 32 | |
| Acrylonitrile butadiene styrene | ABS | 35 | |
| Polyamide | PA | <36 | |
| Polymethylmetacylat | PMMA | <36 | |
| Epoxy | EP | <36 | |
| Polyacetal | POM | <36 | |
| Polyvinyl alcohol | PVA | 37 | |
| Material | Abbreviation | mN/m | |
| Polystyrol | PS | 38 | |
| PS-Phemoloxid | PSPO | 38 | |
| Polychloroprene | CR | 38 | |
| Polyvinylchlorid | PVC | 39 | |
| Celluloseazatat | CA | 39 | |
| Polyester | PET | 41 | |
| Polyimide | PI | 41 | |
| Phenolic resin | PF | 42 | |
| Polyurethan | PUR | 43 | |
| Polyethylenterephtalat | PETP | 43 | |
| Polyamide 6.6 | PA | 43 | |
| Unbleached polyester | UP | 43 | |
| Polycarbonat | PC | 46 | |
| Polyphenylenoxid | PPO | 47 | |
| Styrol Butadien Rubber | SBR | 48 | |
| Polyethersulfon | PES | 50 | |
| Lead | PB | 450 | |
| Aluminium | AL | 840 | |
| Copper | CU | 1100 | |
| Iron | Fe | 2030 | |
In development projects, a lot of time is often spent on selecting the adhesive – while the substrate remains unchanged. This focus is strategically wrong and causes hidden costs in three areas:
| Rework & complaints = feasibility Incorrectly bonded components must be reworked or replaced – often only becoming apparent late in the process. | Process uncertainty as a risk factor A bond that only holds ‘under good circumstances’is a cost risk in series production. | Wrong decisions in material purchasing If series materials are selected without checking their bondability, expensive changes are inevitable later on. |
The technically correct sequence is therefore not – ‘Which adhesive is suitable for my component?’ but rather:
| 1. First classify the substrate | 2. Select the adhesive system | 3. Define the process |
This sequence minimises project durations, validation loops and quality fluctuations.
Are you currently planning a project and want to rely on expertise and experience?
Then please feel free to contact us and we will support you throughout the entire planning process.
The process is already in place? – No problem either!
We are also happy to support existing projects and contribute as partners and problem solvers!